AI & Technology Internship
Location
Hong Kong Science Park (Shatin)
Position
Internship
Job Content
Incipe Academy: AI & Technology Fellowship (Cohort 1)
Location: Hong Kong Science & Technology Parks (HKSTP), Pak Shek Kok, Hong Kong SAR
Duration: 6-8 Weeks (Summer 2026)
Compensation: Monthly Stipend (ITC STEM Internship Scheme) + Internal Innovation Seed Grant
Mission & Vision
At Incipe Academy, we believe AI and hardware convergence will unlock the next generation of real-world innovation. We are recruiting our inaugural class of AI & Technology Fellows. You will be a core part of our "zero-to-one" journey, helping us bridge the gap between artificial intelligence and the physical world. This is an intensive program designed for high-agency builders, not a conventional internship.
Role Description: Co-Design & Venture Building
We are actively looking for young engineers, innovators who wish to master software-hardware co-design. As an AI & Technology Fellow, you will be immersed in a dual-track program designed to sharpen both your engineering rigors and your entrepreneurial instincts:
Integrated Product Engineering: Contribute to our core roadmap by building systems where AI models meet physical hardware. You’ll work on everything from firmware optimization and edge computing to high-level software architecture.
The Venture Track: Understand the "why" behind the "how." You will join our founders in deep-dive sessions on product-market fit, unit economics, supply chain strategy, and the mechanics of scaling a tech startup.
Rapid Prototyping: Gain hands-on experience in our lab, moving quickly from a digital concept to a functional, physical prototype.
Why Join Us?
Founding Impact: As Cohort 1, your work will set the standard for all future fellows.
Zero Layers: You’ll work side-by-side with the founding team and lead engineers.
Builder Playground : Full access to our lab, testing equipment, and a budget to bring your own ideas to life.
Qualifications
The X-Factor: The Internal Innovation Fund
We don’t just want you to execute our roadmap, we want to fuel your creativity.
Unique to this fellowship, every AI & Technology Fellow has the opportunity to utilize our Internal Innovation Seed Grant. If you have a vision for an embedded systems project or a unique co-design solution:
The Pitch: Present your project idea to our leadership team.
The Funding: Receive a dedicated budget for components, sensors, PCBs, and specialized tools.
The Build: Use our lab and technical mentorship to build your project from scratch.
This grant is an additional resource provided on top of your monthly stipend.
Who You Are
The "Polymath" Builder: You are comfortable working across the stack. You might be a software engineer who loves tinkering with microcontrollers, or a hardware enthusiast who writes clean, production-ready code.
AI-Curious: You understand how to implement AI/ML models and are eager to see them function on edge devices or within physical systems.
High Agency: You don’t wait for a ticket to be assigned. You identify bottlenecks, research solutions, and build prototypes.
Entrepreneurial Spirit: You are fascinated by how products become businesses. You want to see the "big picture" of a startup's growth.
Requirements
Currently pursuing a degree in Electrical / Electronic Engineering, Computer Science, Robotics, or a related field (or possess a killer portfolio of self-taught projects).
Proficiency in C/C++, Python, and at least one hardware prototyping platform (e.g., STM32, ESP32, FPGA, or custom PCBs).
Ability to work on-site in Hong Kong for the full 6-8 weeks duration.
Be adaptable, resilient, and ready to help us build the culture of this fellowship.
How to Apply
How to Apply
We value the things you’ve learnt, built and your achievements:
Showcase your work: Drop a link to your GitHub, personal portfolio
Send your CV: Keep it simple—we’re looking for impact.
Submit here: https://docs.google.com/forms/d/e/1FAIpQLSfvVkMDxkUjGDkE4kDR5Gerkb1-3IFrlt_L1QUjkqwttQvyxQ/viewform
Incipe Academy is an equal opportunity employer. Applications for Cohort 1 are reviewed on a rolling basis; early submission is strongly encouraged.
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